Equipment Features

• Fully conventional hot air reflow oven with up to 14 independent zone and quick response heating system
• Automatically generating PCB reflow profile and beings capable of profile analysing and the corresponding controls adjustment
• Recycling and reuse of flux to meet the standard of ISO14000
• Build for Lead-free solder pastes  process. The oxygen concentration in the oven is controlled under 20PPM
• Remote data monitoring, troubleshooting and recipes management is built within HMI

Controls Features

• 14 independent zone with 28 channels high precision thermo controls at ±1°C accuracy
• On-line supervising conveyor speed and the hot blast
• PCB-droping detection
• Built in PCB reflow profile analysis
• Automatic motor-controlled PCB width adjustment
• N2 diffusion controls to meet oxygen concentration requirements
• On-line recipes management, production scheduling, historical and alarming log, and remote diagnosis via Ethernet